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Capacitors Large Form Factors

Below is a list of technical and application notes relevant to Johanson Dielectrics Large Form Factors MLCC.

Title Purpose / Key Insight
Soldering & Handling Precautions for Large Form
  • Large & Planar Capacitors Need Extra Care – Body sizes above 1812 and planar arrays are prone to thermal shock and handling damage that may not be visible at first but can grow into latent failures. Careful handling from receiving through assembly is essential.
  • Controlled Soldering & Cooling – Use gradual preheat, reflow, and cool-down profiles (≤2 °C/sec) to avoid cracks. Hand soldering and wave soldering are discouraged; if required, strict precautions must be followed to prevent capacitor failure.
PCB Pad Layout Recommendations
  • Covers pad sizes, spacing, and solder fillet control to ensure reliable solder joints.
  • Includes guidance on minimizing mechanical stress that can cause capacitor cracking during reflow or handling.
Recommended Storage Conditions
  • Lists environmental requirements for long-term capacitor storage before assembly.
  • Emphasizes humidity and temperature control to prevent oxidation or degradation.
Part Number Explanation
  • Breaks down Johanson’s capacitor part numbering system into clear segments.
  • Each section of the code represents attributes such as dielectric, capacitance value, tolerance, case size, termination, and voltage rating.