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NEW! CapStrate® Design Guide

CapStrate® - Bulk Capacitance Embedded in a High k Ceramic Substrates

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“Small Space” Power Electronic Design Solutions

CapStrates® are ceramic substrates with capacitors embedded in the substrate. The top and bottom layers of this substrate can be designed with custom metallization patterns for microelectronic circuits. This technology works wonders for microelectronic subassembly designs that have volumetric challenges. The ceramic substrate can also operate at temperatures higher than the typical FR4 substrate. From there, engineers can deploy a CapStrate® subassembly in environments where a commercial FR4 substrates cannot handle.

A key feature of our CapStrate® lies in their utilization of high-k dielectrics for increased bulk capacitance. This enables the substitution of discrete capacitors with bulk capacitance integrated into ceramic substrates. While standard voltage ratings typically range from 100 to 1000V, our team welcomes discussions regarding specialized voltage requirements.

Equipped with this guide, design engineers can:

  • Tailor solutions to accommodate intricate board layouts, optimizing space utilization ("Space Saver").
  • Seamlessly transition from quick-turn prototypes to high-volume production.
  • Achieve reduced component count and heightened reliability.
  • Avail themselves of end-to-end support encompassing design, manufacturing, and assembly services.

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Download - CapStrate® Design Guide

For Unique Design Requirements - Contact Johanson Engineers

NEW! Website Section – The “Applications” Tab

We Invite Design Engineers to Utilize the Applications Tab

Applications Tab

JOHANSON is pleased to announce the addition of a new “Applications” section on Johanson Dielectrics website. It showcases a diverse range of applications where are products and services can be used.

Presently, the featured applications include:

  • Amazon Sidewalk
  • Automotive
  • Semiconductor Processing Equipment
  • Military/Aerospace, and High Reliability

This new section is designed to facilitate easy access for design engineers, allowing swift navigation to a specific application, and displays the comprehensive array of JOHANSON products and services tailored to meet their requirements.

Stay tuned as we continue to add more applications to this section.

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CapStrate® Bulk Capacitance Embedded in a High-k Ceramic Substrate

Ask about this product  CapStrate Design Guide PDF

Design Guide

  • Customizable to accommodate challenging board layouts "Space Saver"
  • Quick turn prototype to high volume production
  • Reducing component count and higher reliability
  • Unique customer solutions
  • One-stop design, manufacturing, and assembly
capstrate

CapStrate® Selection

Choosing the correct CapStrate® influences the mechanical and electrical function of a design. Johanson Dielectrics offers ceramic substrates for use in application specific environments. It is recommended to choose the right substrate that meets the required electrical requirements and is suitable for the environment the product will operate in.

Johanson Dielectrics offers a variety of materials with a high dielectric constant (K) that can be used within CapStrate® designs. The dielectric constant is directly related to the amount of bulk capacitance that can be realized and allows for compact form factors.

Table 1: Available CapStrate® & Electrical Properties
CapStrate® Material X7R NP0 X8R
Dissipation Factor <2.5% <0.15% <2.5%
Dielectric Strength (V/mil) 200 300 200
Temperature Coefficient ±15% 0 ± 30 ppm/°C ±15%
Temperature Range -55 °C to +125 °C -55 °C to +125 °C -55 °C to +150 °C

CapStrate® Sizes & Shapes

Table 2: Rectangular Dimensions (CapStrate®)
Dimension Minimum Maximum Tolerance
Thickness 0.050” (1.27mm) 0.215” (5.461mm) +/- 0.005 (0.127mm)
Length 0.20” (5.08mm) 2.00”/1.00” (50.8/25.4mm) +/- 0.005 (0.127mm)
Width 0.20” (5.08mm) 1.00”/2.00” (25.4/50.8mm) +/- 0.005 (0.127mm)
Temperature Range -55 °C to +125 °C -55 °C to +125 °C -55 °C to +150 °C
Table 3: Circular Dimensions (CapStrate®)
Dimension Minimum Maximum Tolerance
Thickness 0.050” (1.27mm) 0.215” (5.46mm) +/- 0.005 (0.127mm)
Diameter 0.20” (5.08mm) 2.00” (50.8mm) +/- 0.005 (0.127mm)
Made with HTML Tables

Integrating Bulk Capacitance

Integrating Bulk Capacitance

The advantages of CapStrate® Dielectrics can be fully realized by replacing discrete capacitors with bulk capacitance from the ceramic substrates. The amount of capacitance that can be utilized varies depending on the design dimensions.

Tables 4 and 5 reference the maximum amount of capacitance that can be designed for dimensional, substrate and voltage constraints.

Typical voltage ratings vary from 100 to 1000V, however, engineers are invited to discuss special voltage requirements not listed below.

Table 4: Rectangular Bulk Capacitance (CapStrate®)
NP0 Length Width Thickness 100V 250V 500V 1000V
Maximum Size 2.00" (50.8mm) 1.00" (25.4mm) 0.150" (3.81mm) 5000nF 2500nF 1400nF 940nF
Minimum Size 0.20" (5.08mm) 0.20" (5.08mm) 0.050" (1.27mm) 30nF 9nF 5nF 2.8nF
X7R Length Width Thickness 100V 250V 500V 1000V
Maximum Size 2.00" (50.8mm) 1.00" (25.4mm) 0.150" (3.81mm) 120000nF 60000nF 25000nF 8000nF
Minimum Size 0.20" (5.08mm) 0.20" (5.08mm) 0.050" (1.27mm) 800nF 200nF 70nF 20nF
X8R Length Width Thickness 100V 250V 500V 1000V
Maximum Size 2.00" (50.8mm) 1.00" (25.4mm) 0.150" (3.81mm) 84000nF 42000nF 17500nF 5600nF
Minimum Size 0.20" (5.08mm) 0.20" (5.08mm) 0.050" (1.27mm) 560nF 140nF 49nF 14nF

Integrating Bulk Capacitance & Capacitancy Density

  • Custom Geometry
  • Increased Bulk Capacitance
  • High Voltage Capabilities
  • Reduction in Size
Table 5: Circular Bulk Capacitance (CapStrate®)
NP0 Diameter Thickness 100V 250V 500V 1000V 1000V
Maximum Size 2.00" (50.8mm) 0.150” (3.81mm) 7600nF 3800nF 2600nF 1400nF 940nF
Minimum Size 0.20" (5.08mm) 0.050" (1.27mm) 25nF 6nF 3nF 1.7nF 2.8nF
X7R Diameter Thickness 100V 250V 500V 1000V 1000V
Maximum Size 2.00" (50.8mm) 0.150” (3.81mm) 180000nF 95000nF 40000nF 12000nF 8000nF
Minimum Size 0.20" (5.08mm) 0.050" (1.27mm) 550nF 140nF 45nF 15nF 20nF
X8R Diameter Thickness 100V 250V 500V 1000V 1000V
Maximum Size 2.00" (50.8mm) 0.150” (3.81mm) 126000nF 66500nF 28000nF 8400nF 5600nF
Minimum Size 0.20" (5.08mm) 0.050" (1.27mm) 385nF 98nF 31.5nF 10.5nF 14nF

Additional sizes and form factors not listed are possible. Contact Johanson to assess the feasibility of your design. Reference table 6 for the maximum capacitance density that can be used for a given substrate. Capacitance density, below, is presented in nF/(mils)3. This is the maximum amount of capacitance available in a given volume.

Table 6: Max Capacitance Density
Rectangular X7R NP0 X8R Circular X7R NP0 X8R
100V 4.00E-04 1.67E-05 2.80E-04 100V 3.82E-04 1.61E-02 1.13E-02
250V 2.00E-04 8.33E-06 1.40E-04 250V 2.02E-04 8.10E-03 5.67E-03
500V 8.33E-05 4.67E-06 5.83E-05 500V 8.49E-05 5.51E-03 3.86E-03
1000V 2.67E-05 3.13E-06 1.87E-05 1000V 2.54E-05 2.97E-03 2.08E-03

Metallization/Solder Pads

Johanson Dielectrics offers a variety of metallization schemes that are high reliability conductors. These metals can be utilized as conductors, solder pads, or methods of thermal transfer. Designers should select the available metal based on the metallization properties that best suit their design. Careful selection of particular metallizations is dependent on requirements for solderability, temperature resistance, and electrical performance.

Table 7: Metallization Schemes Available
Dielectric Ag / Pt Ni / Au Ag / Ni / Au
X7R X X -
X8R X X -
NP0 X - X
Table 8: Metallization Properties
Material Property Ag / Pt Ni / Au Ag / Ni / Au
Recommended Thickness 14µm 7-12µ” Contact Factory
Max Solder Temp 218°C 260°C 230°C
Table 9: Solder Pad Dimensions
Metallization Length (Minimum) Width (Minimum) Pad Spacing (Minimum)
Ag/Pt 0.015" (0.381mm) 0.010" (0.254mm) 0.007" (0.178mm)
Ni/Au 0.015" (0.381mm) 0.010" (0.254mm) 0.007" (0.178mm)
Ag/Ni/Au 0.015" (0.381mm) 0.010" (0.254mm) 0.007" (0.178mm)

Traces & Tolerances

Table 10: Standard Conductor Traces & Tolerances
Metallization Line Width / Space (Min) Line Width / Space Tolerance(Max) Trace / Metal Thickness
Ag/Pt 0.007” (0.178mm) 0.003"-0.005"(0.076-0.127mm) 0.014” (0.356mm)
Ni/Au 0.007” (0.178mm) 0.014” (0.356mm)
Ag/Ni/Au Ag/Ni/Au 0.014” (0.356mm)

Vias Definition & Dimensions

Vias are used to connect different layers in the CapStrate® as a means of an electrical or thermal connection. Johanson Dielectrics offers plated through-hole vias for designers to use

Table 11: Via Mechanical Dimensions
Via Style Hole Diameter(Minimum) Hole to Hole(Minimum Spacing) Via to Edge(Minimum Spacing) Plated Through-hole
Plated Through-hole 0.028"(0.771mm) 0.012"(0.305mm) 0.015"(0.381mm)

"We encourage all designers to submit their drawings or ideas for quick and easy feedback."

Assembly Services

Available in-house

Includes: but is not limited to, soldering resistors, inductors, wires and transistors. One-stop design, manufacturing, and assembly ensures customers receive completed product, without the hassle of developing an assembly stations.

How to Submit Custom CapStrate® Designs

  • Follow Johanson’s design guidelinesand standard specifications.
  • Provide CAD data in multiple layers.
  • Identify “A” side and “B” sidefor double-patterned circuits.
  • Provide tolerances and annotation.
  • List CapStrate® type, dimensions, and rated voltage.
  • Specify metallizations, thickness and tolerances, pads.
  • Specify conductor traces, type, spacing, and tolerances.
  • List any environmental or electrical testing needed.
  • Other inspection or acceptance criteria.

Don't miss the opportunity to work with our outstanding design engineers.

Send us a message for more information. We look forward to assisting you with your unique design requirements.

Johanson Dielectrics has a specialized high-reliability department with extensive in-house testing capabilities. Our testing includes, but is not limited to the following:

Electrical & Mechanical Inspections

  • 100% Visual Inspection
  • DWV, Voltage Breakdown
  • Capacitance, Dissipation Factor
  • Resistance & Continuity Testing
  • Temperature Voltage Coefficient(TVC)
  • Temperature CapacitanceCoefficient (TCC)

Environmental Testing

  • Bond Pull Test
  • Temperature Cycling
  • Resistance to Solder Heat
  • Shock and Vibration Testing

Analytical Testing

  • SEM Inspection
  • Solderability Testing
  • Destructive Physical Analysis

Quality Commitments JOHANSON DIELECTRICS

ISO certified

Commitments and Certifications We are committed to making products of the highest quality, performance, and value. Our new design and manufacturing facility employs state of the art equipment and practices. All employees participate in quality awareness and SPC training classes, and our quality system is certified to ISO 9001.

RoHS certified

RoHS Standard parts supplied by Johanson Dielectrics, Inc. are fully compliant to the European Union Directives 2002/95/EC, 2011/65/EU, and Annex II (EU) 2015/863 of the European Parliament and of the Council of 31 March 2015 on the Restriction of the use of certain Hazardous Substances in electrical and electronics equipment (RoHS Directives).

reach certified

REACH Parts (articles) supplied by Johanson Dielectrics meet the requirements for REACH and do not contain any of the SVHC chemicals listed above the levels mandated by the ECHA.

Military/Aerospace, & High Reliability

Johanson Dielectrics and Johanson Technology have over 50 years of experience specializing in the design and manufacture of high-quality ceramic products. Johanson provides Mil Standard Qualifications, Mil-Standard screening, and COTS for Ceramic Chip Capacitors, RF Passives, and RF Inductors to high-reliability applications globally.

In addition to manufacturing, the Camarillo facility has a complete High-Reliability department with in-house testing capabilities.

Military and aerospace

Johanson Products and Services for Military/Aerospace, and High Reliability Designers

  1. Click here for Products
  2. Mil-Standards
  3. Custom Products
  4. RF Testing Capabilities
  5. Quality Certifications
  6. Enviromental Testing
  7. Special Testing Capabilities

Contact our engineers with your high-reliability requirements

Testing & Inspections

In-House Testing Capabilities
In addition to manufacturing, the Camarillo facility has a complete High Reliability department with in-house testing capabilities.

Comprehensive Mil-Standard Testing Groups A, B & C

Electrical & Mechanical Inspections

  • 100% Electrical Testing
  • Cap, DF, IR, DWV, Voltage Breakdown
  • 100% Visual Inspection (Mil 883 Class K or S Options)
  • Full Data on Serialized Units
  • Hot IR Testing
  • Temperature Capacitance Coefficient (TCC)
  • Temperature Voltage Coefficient (TVC)
Camarillo Facility image
Environmental Testing Factory machine image

Environmental Testing

  • Burn In / Voltage Conditioning
  • Life Testing
  • Class H, K or S Element Evaluation
  • HALT / HASS Testing
  • Humidity Testing
  • Moisture Resistance
  • Resistance to Solder Heat
  • Shear Test / Bond Pull Test
  • Bend Testing
  • Steam Age
  • Temperature Cycling
  • Thermal Shock Testing
  • Shock / Vibration Testing
  • Wire Bond Testing

Analytical Testing

  • Destructive Physical Analysis (DPA)
  • Radiographic Inspection
  • SEM Inspection
  • Solderability Testing
  • Acoustic Microscopy (Sonoscan) Inspection
  • XRF Analysis
Analytical Testing machine image

RF & Microwave Testing Expertise

  • Vector Network Analyzer Measurements
  • Resonant Line Measurements for ESR at Frequency

Simulation software and designer libraries.

MLCC Termination Options

Termination Type Barrier to Prevent Solder Leaching RoHS Primary Applications
Ni/Sn Ni Yes All solder applications where RoHS is required. This is Johanson’s standard termination used by the largest number of customers. Most likely to be in stock at Johanson or at Johanson authorized distributors.
Ni/SnPb Ni No Military applications where the lead (Pb) mitigates Tin whisker growth.
Flexterm Ni/Sn Ni Yes Flexible terminations for high physical stress applications
Flexterm Ni/SnPb Ni No Flexible terminations for high physical stress applications
Ni/Au Gold Termination Ni Yes Parts are epoxied in place or a mix of solder and epoxy attachment is used. Controlled Au thickness to avoid Gold embrittlement issues when soldering. Premium price.
Cu/Sn(Copper barrier) Cu Yes This non-magnetic termination is best suited for application where very high inductance / magnetic fields are present. Use where RoHS is required. Most common non-magnetic termination.
Cu/SnPb(Copper barrier) Cu No This non-magnetic termination is best suited for application where very high inductance / magnetic fields are present.
PdAg None Yes No plating - solderable thick film PdAg alloy termination.Premium price.
PtAg None Yes No plating - solderable thick film PdAg alloy termination. Premium price.

Single Layer Termination Options

Termination Type Barrier to Prevent Solder Leaching RoHS Primary Applications
TiW/Ni/Au Ni Yes Chip & Au wire where capacitor is soldered in place or a mix of solder and epoxy attachment is used.
TiW/Au None Yes Chip & Au wire where capacitor is epoxy attached. Optimum termination for wirebonding. Cannot solder this chip as substantial leaching will occur.

Lead-Frame Termination Options

Termination Type Barrier to Prevent Solder Leaching RoHS Primary Applications
Ni None Yes Used in very high-temp applications
Cu/Ni/SnPb Ni No Typically used in military applications
CuSn6 Phosphor Bronze Ni No SnPb plate
Iron-Nickel Alloy Ni Yes Sn plate
Pure Silver Leads None Yes Used in very high power RF. Premium price.

Ask a Question

If you have unique needs or require additional technical information, contact your Johanson Representative or submit a technical request on our website at: Ask a question

Applications

Applications
RF Bypass/Decoupling ● ● ● ● ● ● ●
Connector/Cable Filters ● ● ● ● ● ●
Housing/Chassis Filters ● ● ●
Mains Filtering Certified ● ●
Power Conditioning/Rail Filtering ● ● ● ● ● ● ● ●
SwitchMode PowerSupply Filtering ● ● ● ● ●
EMI/RFI Filtering ● ● ● ● ● ● ● ● ●
DC Block/Coupling ● ● ● ●
Antenna & Impedance Matching ● ● ● ●
RF Filters (e.g. LC, Pi, BPF, LPF) ● ● ● ● ● ●
Microwave Circuits ● ● ● ● ● ●
Millimeterwave Circuits ● ●
Power Amplifier Matching ● ● ● ● ●
RF Circuit Matching ● ● ● ●
MMIC SubMount ●

Collaborative Design Productions

Capstrate- Embedded Capacitors
Capstrate- Embedded Capacitors
Discrete Circuit
Capstrate® Circuit
Variable Pitch Capacitors
Unique Geommetries

Unique Geometries

Custom Substrates
Custom Substrates

k values - 9.3 to 40,000